Chemical Vapor Deposition: Fundamentals and Techniques

This lecture covers the fundamentals and techniques of Chemical Vapor Deposition (CVD). It starts with mass transfer from the gas phase to the surface, discussing equilibrium concentration, gas transfer rate, and Fick's law. The film growth rate calculation is explained, including diffusion flux and surface reaction flux. Different CVD techniques such as Atmospheric Pressure CVD, Low-pressure CVD, and Plasma-enhanced CVD are detailed, highlighting their operating principles and advantages. The lecture concludes with insights on film growth rate control based on temperature and pressure. Instructor Martin Gijs provides a comprehensive overview of CVD processes and their applications in microfabrication.