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This lecture covers the chemical vapor deposition (CVD) processes for oxide formation, including wet and dry thermal oxidation of silicon, as well as the atomic layer deposition (ALD) of Al2O3, Ru, and TiN. It explains the mechanisms and equipment used in these processes, such as the LOCOS process, ALD equipment setup, and the four-step deposition process involving precursors like trimethylaluminium and water. The lecture also discusses examples of other materials like TiN, Ru, and NH3, highlighting their deposition temperatures and chemical properties. Overall, it provides insights into micro and nanofabrication techniques, emphasizing the importance of thin film deposition in microelectronic components.