Person
Cyrille Hibert
Related publications (28)
All-stencil transistor fabrication on 3D silicon substrates
Jürgen Brugger, Luis Guillermo Villanueva Torrijo, Andreea Veronica Savu, Cyrille Hibert, Cristina Martin Olmos, Philippe Langlet, Oscar Vazquez Mena, Peter Vettiger, Katrin Sidler Arnet
The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been propo ...
Iop Publishing Ltd2012High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon
Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Marion Hermersdorf
This paper reports on the fabrication of sub-micron trenches on silicon-on-insulator (SOI) required in many MEMS devices and on bulk silicon. Trenches in the range of 100-500 nm had been etched with the deep reactive ion etching (DRIE) by using the SHARP ( ...
2011Two-Dimensional MEMS Stage Integrated With Microlens Arrays for Laser Beam Steering
Cyrille Hibert, Sven Holmström, Sertan Kutal Gökce, David Bowman
A novel microelectromechanical stage with one uniaxial set of combs capable of 2-D actuation is presented. A polymer microlens array (MLA) is mounted vertically onto the stage. Driven at resonance, the stage deflects 124 mu m out of plane and 34 mu m in pl ...
Institute of Electrical and Electronics Engineers20113D stacked arrays of fins and nanowires on bulk silicon
Mihai Adrian Ionescu, Cyrille Hibert, Matthieu Bopp
The development of a particular etching recipe involving two sequences of a Deep Reactive Ion Etching followed by an isotropic etching step for the realization of 3D stacked arrays of fins and nanowires on bulk silicon is reported. Such a recipe can be use ...
Elsevier2010Fluorine based plasma treatment of biocompatible silicone elastomer. Effect of temperature on etch rate and surface properties
Arnaud Bertsch, Cyrille Hibert
This paper describes F-based dry etching and resulting surface properties of biocompatible silicone elastomer. The etch rate of polysiloxane and surface morphology was found to be highly temperature dependent. An increase in temperature results in a signif ...
2008Tunable, high aspect ratio pillars on diverse substrates using copolymer micelle lithography: an interesting platform for applications
Jürgen Brugger, Cyrille Hibert, Sivashankar Krishnamoorthy
We demonstrate the use of copolymer micelle lithography using polystyrene-block-poly(2-vinylpyridine) reverse micelle thin films in their as-coated form to create nanopillars with tunable dimensions and spacing, on different substrates such as silicon, sil ...
20080-level Vacuum Packaging RT Process for MEMS Resonators
Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Nicolas Abelé
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...
2008High quality factor copper inductors integrated in deep dry-etched quartz substrates
Mihai Adrian Ionescu, Didier Bouvet, Cyrille Hibert
This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) and high self-resonance frequency (SRF) devices using quartz insulating substrates and thick high-conductivity copper lines. Inductors are key devices in RF cir ...
Springer-Verlag2007Fabrication of vertical digital silicon optical micromirrors on suspended electrode for guided-wave optical switching applications
Philippe Renaud, Cyrille Hibert, Philippe Flückiger, Roland Guerre
This paper presents a novel technological and design study of optical guided- wave MicroElectroMechanical Systems (MEMS) switch. We work on a concept of hermetic assembly in which a MEMS wafer is covered (top-down) by a crossing optical waveguide wafer. Th ...
2005Fabrication and electrical characterization of high performance copper/polyimide inductors
Mihai Adrian Ionescu, Catherine Dehollain, Didier Bouvet, Cyrille Hibert
This paper presents fabrication and RF characterization results of spiral inductors fabricated using a developed damascene-like thick-copper / polyimide process module. This module has low thermal budget and is compatible with current IC interconnect archi ...
2005