Electron cyclotron resonanceElectron cyclotron resonance (ECR) is a phenomenon observed in plasma physics, condensed matter physics, and accelerator physics. It happens when the frequency of incident radiation coincides with the natural frequency of rotation of electrons in magnetic fields. A free electron in a static and uniform magnetic field will move in a circle due to the Lorentz force. The circular motion may be superimposed with a uniform axial motion, resulting in a helix, or with a uniform motion perpendicular to the field (e.
Plasma stabilityThe stability of a plasma is an important consideration in the study of plasma physics. When a system containing a plasma is at equilibrium, it is possible for certain parts of the plasma to be disturbed by small perturbative forces acting on it. The stability of the system determines if the perturbations will grow, oscillate, or be damped out. In many cases, a plasma can be treated as a fluid and its stability analyzed with magnetohydrodynamics (MHD).
TokamakA tokamak (ˈtoʊkəmæk; токамáк) is a device which uses a powerful magnetic field to confine plasma in the shape of a torus. The tokamak is one of several types of magnetic confinement devices being developed to produce controlled thermonuclear fusion power. , it was the leading candidate for a practical fusion reactor. Tokamaks were initially conceptualized in the 1950s by Soviet physicists Igor Tamm and Andrei Sakharov, inspired by a letter by Oleg Lavrentiev. The first working tokamak was attributed to the work of Natan Yavlinsky on the T-1 in 1958.
Physical vapor depositionPhysical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Corona dischargeA corona discharge is an electrical discharge caused by the ionization of a fluid such as air surrounding a conductor carrying a high voltage. It represents a local region where the air (or other fluid) has undergone electrical breakdown and become conductive, allowing charge to continuously leak off the conductor into the air. A corona discharge occurs at locations where the strength of the electric field (potential gradient) around a conductor exceeds the dielectric strength of the air.
Neutral-beam injectionNeutral-beam injection (NBI) is one method used to heat plasma inside a fusion device consisting in a beam of high-energy neutral particles that can enter the magnetic confinement field. When these neutral particles are ionized by collision with the plasma particles, they are kept in the plasma by the confining magnetic field and can transfer most of their energy by further collisions with the plasma. By tangential injection in the torus, neutral beams also provide momentum to the plasma and current drive, one essential feature for long pulses of burning plasmas.
Electrical breakdownIn electronics, electrical breakdown or dielectric breakdown is a process that occurs when an electrically insulating material (a dielectric), subjected to a high enough voltage, suddenly becomes a conductor and current flows through it. All insulating materials undergo breakdown when the electric field caused by an applied voltage exceeds the material's dielectric strength. The voltage at which a given insulating object becomes conductive is called its breakdown voltage and, in addition to its dielectric strength, depends on its size and shape, and the location on the object at which the voltage is applied.
Brush dischargeA brush discharge is an electrical disruptive discharge similar to a corona discharge that takes place at an electrode with a high voltage applied to it, embedded in a nonconducting fluid, usually air. It is characterized by multiple luminous writhing sparks, plasma streamers composed of ionized air molecules, which repeatedly strike out from the electrode into the air, often with a crackling sound. The streamers spread out in a fan shape, giving it the appearance of a "brush".
Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
