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In-IC Strategies for 3D Devices in Bulk Silicon

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In-IC Strategies for 3D Devices in Bulk Silicon

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Scanning photocurrent microscopy reveals electron-hole asymmetry in ionic liquid-gated WS2 transistors

A Schottky-Barrier Silicon FinFET with 6.0 mV/dec Subthreshold Slope over 5 Decades of Current

Memristive Biosensors Under Varying Humidity Conditions

Single Crystal Silicon UHF Wine-Glass Ring Resonator with HfO2 Solid Dielectric Gap embedded in a Field Effect Transistor

BSIM6: Analog and RF Compact Model for Bulk MOSFET

Trans-Capacitance Modeling in Junctionless Gate-All-Around Nanowire FETs

Modeling Asymmetric Operation in Double-Gate Junctionless FETs by Means of Symmetric Devices

Parallel vs. Serial Inter-plane communication using TSVs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

A Schottky-Barrier Silicon FinFET with 6.0 mV/dec Subthreshold Slope over 5 Decades of Current

Scanning photocurrent microscopy reveals electron-hole asymmetry in ionic liquid-gated WS2 transistors

BSIM6: Analog and RF Compact Model for Bulk MOSFET

Trans-Capacitance Modeling in Junctionless Gate-All-Around Nanowire FETs

Modeling Asymmetric Operation in Double-Gate Junctionless FETs by Means of Symmetric Devices

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Memristive Biosensors Under Varying Humidity Conditions

Single Crystal Silicon UHF Wine-Glass Ring Resonator with HfO2 Solid Dielectric Gap embedded in a Field Effect Transistor

Parallel vs. Serial Inter-plane communication using TSVs

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication