Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Co-fired ceramicCo-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
Switched-mode power supplyA switched-mode power supply (switching-mode power supply, switch-mode power supply, switched power supply, SMPS, or switcher) is an electronic power supply that incorporates a switching regulator to convert electrical power efficiently. Like other power supplies, an SMPS transfers power from a DC or AC source (often mains power, see AC adapter) to DC loads, such as a personal computer, while converting voltage and current characteristics.
Series and parallel circuitsTwo-terminal components and electrical networks can be connected in series or parallel. The resulting electrical network will have two terminals, and itself can participate in a series or parallel topology. Whether a two-terminal "object" is an electrical component (e.g. a resistor) or an electrical network (e.g. resistors in series) is a matter of perspective. This article will use "component" to refer to a two-terminal "object" that participate in the series/parallel networks.
Mechanical–electrical analogiesMechanical–electrical analogies are the representation of mechanical systems as electrical networks. At first, such analogies were used in reverse to help explain electrical phenomena in familiar mechanical terms. James Clerk Maxwell introduced analogies of this sort in the 19th century. However, as electrical network analysis matured it was found that certain mechanical problems could more easily be solved through an electrical analogy.
Buck converterA buck converter or step-down converter is a DC-to-DC converter which steps down voltage (while stepping up current) from its input (supply) to its output (load). It is a class of switched-mode power supply. Switching converters (such as buck converters) provide much greater power efficiency as DC-to-DC converters than linear regulators, which are simpler circuits that lower voltages by dissipating power as heat, but do not step up output current.
FrequencyFrequency (symbol f) is the number of occurrences of a repeating event per unit of time. It is also occasionally referred to as temporal frequency for clarity and to distinguish it from spatial frequency. Frequency is measured in hertz (symbol Hz) which is equal to one event per second. Ordinary frequency is related to angular frequency (symbol ω, in radians per second) by a scaling factor of 2π. The period (symbol T) is the interval of time between events, so the period is the reciprocal of the frequency, f=1/T.
Electrical reactanceIn electrical circuits, reactance is the opposition presented to alternating current by inductance and capacitance. Along with resistance, it is one of two elements of impedance; however, while both elements involve transfer of electrical energy, no dissipation of electrical energy as heat occurs in reactance; instead, the reactance stores energy until a quarter-cycle later when the energy is returned to the circuit. Greater reactance gives smaller current for the same applied voltage.
Maximum power transfer theoremIn electrical engineering, the maximum power transfer theorem states that, to obtain maximum external power from a power source with internal resistance, the resistance of the load must equal the resistance of the source as viewed from its output terminals. Moritz von Jacobi published the maximum power (transfer) theorem around 1840; it is also referred to as "Jacobi's law". The theorem results in maximum power transfer from the power source to the load, and not maximum efficiency of useful power out of total power consumed.
Polycrystalline siliconPolycrystalline silicon, or multicrystalline silicon, also called polysilicon, poly-Si, or mc-Si, is a high purity, polycrystalline form of silicon, used as a raw material by the solar photovoltaic and electronics industry. Polysilicon is produced from metallurgical grade silicon by a chemical purification process, called the Siemens process. This process involves distillation of volatile silicon compounds, and their decomposition into silicon at high temperatures. An emerging, alternative process of refinement uses a fluidized bed reactor.
