Fabrication of AFM Probes: Tip, Cantilever and Chip micromachining by DRIE
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
We report about a new process we have developed to fabricate miniaturized double layer octupoles that can be operated as electrostatic scanner/stigmators for charged particle beams. The fabrication process is based on deep reactive ion etching (DRIE) and a ...
We describe the microfabrication and use of elastomeric and rigid two-level microfluidic networks (μFNs), made of poly(dimethylsiloxane) (PDMS) or Si, for patterning surfaces. The first level corresponds to microchannels and the second to via holes through ...
The inexpensive fabrication of high-quality probes for nearfield optical applications is still unsolved although several methods for integrated fabrication have been proposed in the past. A further drawback is the intensity loss of the transmitted light in ...
An epitaxial 200 nm thick film of Pb(Zr0.40Ti0.60)O-3 (PZT) has been deposited by reactive rf magnetron sputtering on conductive Nb-doped SrTiO3 (100) (STO). The patterning process involved electron-beam lithography of polymethylmethacrylate, fabrication o ...
Evaporation through shadow masks (nanostencils) overcomes the limitations typically given by patterning methods involving conventional optical lithography and etching, such as diffraction limits and etch-selectivity. This paper demonstrates the fabrication ...
Low-frequency noise (LFN) characteristics of dry-and wet-etched InAlAs/InGaAs HEMTS have been studied. It is found that due to passivation of deep traps by hydrogen the excess LFN (1/f and G-R) in dry-etched HEMTs is significantly lower than in wet-etched ...
A novel Silicon Sacrificial Layer Dry Etching (SSLDE) technique using sputtered amorphous or LPCVD polycrystalline silicon as sacrificial layers and a dry fluorine-based (SF₆) plasma chemistry as releasing process is reported with a detailed experimental s ...
This thesis deals with the development of microfabrication technologies based on photoplastic structuring by lithographic and molding techniques. These technologies, combined with an original releasing method, allow for the simple fabrication of pseudo thr ...
The objective of this work is to fabricate a scanning probe sensor that combines the well-established method for atomic force microscopy, employing a micro-machined Si cantilever and integrated tip, with a probe for the optical near field. A photosensitive ...
Epitaxial 50 nm and 200 nm thick films of Pb(Zr0.40Ti0.60)O-3 (PZT) have been deposited by reactive rf magnetron sputtering on conductive Nb-doped SrTiO3(100) (STO). The patterning process involved electron beam lithography of polymethylmethacrylate (PMMA) ...