Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
3D printing3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, with material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer. In the 1980s, 3D printing techniques were considered suitable only for the production of functional or aesthetic prototypes, and a more appropriate term for it at the time was rapid prototyping.
Multi-chip moduleA multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
System on a chipA system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Motorola 68000The Motorola 68000 (sometimes shortened to Motorola 68k or m68k and usually pronounced "sixty-eight-thousand") is a 16/32-bit complex instruction set computer (CISC) microprocessor, introduced in 1979 by Motorola Semiconductor Products Sector. The design implements a 32-bit instruction set, with 32-bit registers and a 16-bit internal data bus. The address bus is 24 bits and does not use memory segmentation, which made it easier to program for.
Digital cameraA digital camera is a camera that captures photographs in digital memory. Most cameras produced today are digital, largely replacing those that capture images on photographic film. Digital cameras are now widely incorporated into mobile devices like smartphones with the same or more capabilities and features of dedicated cameras (which are still available). High-end, high-definition dedicated cameras are still commonly used by professionals and those who desire to take higher-quality photographs.
WebcamA webcam is a video camera which is designed to record or stream to a computer or computer network. They are primarily used in video telephony, live streaming and social media, and security. Webcams can be built-in computer hardware or peripheral devices, and are commonly connected to a device using USB or wireless protocols. Webcams have been used on the Internet as early as 1993, and the first widespread commercial one became available in 1994. Early webcam usage on the Internet was primarily limited to stationary shots streamed to web sites.
Flow process chartThe flow process chart is a graphical and symbolic representation of the activities performed on the work piece during the operation in industrial engineering. The first structured method for documenting process flow, e.g., in flow shop scheduling, the flow process chart, was introduced by Frank and Lillian Gilbreth to members of ASME in 1921 as the presentation "Process Charts, First Steps in Finding the One Best Way to Do Work". The Gilbreths' tools quickly found their way into industrial engineering curricula.
