Static random-access memoryStatic random-access memory (static RAM or SRAM) is a type of random-access memory (RAM) that uses latching circuitry (flip-flop) to store each bit. SRAM is volatile memory; data is lost when power is removed. The term static differentiates SRAM from DRAM (dynamic random-access memory) — SRAM will hold its data permanently in the presence of power, while data in DRAM decays in seconds and thus must be periodically refreshed.
Transistor countThe transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in the cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
PIC microcontrollersPIC (usually pronounced as [phɪk]) is a family of microcontrollers made by Microchip Technology, derived from the PIC1650 originally developed by General Instrument's Microelectronics Division. The name PIC initially referred to Peripheral Interface Controller, and is currently expanded as Programmable Intelligent Computer. The first parts of the family were available in 1976; by 2013 the company had shipped more than twelve billion individual parts, used in a wide variety of embedded systems.
Object storageObject storage (also known as object-based storage) is a computer data storage that manages data as objects, as opposed to other storage architectures like which manages data as a file hierarchy, and block storage which manages data as blocks within sectors and tracks. Each object typically includes the data itself, a variable amount of metadata, and a globally unique identifier. Object storage can be implemented at multiple levels, including the device level (object-storage device), the system level, and the interface level.
Memory latencyMemory latency is the time (the latency) between initiating a request for a byte or word in memory until it is retrieved by a processor. If the data are not in the processor's cache, it takes longer to obtain them, as the processor will have to communicate with the external memory cells. Latency is therefore a fundamental measure of the speed of memory: the less the latency, the faster the reading operation. Latency should not be confused with memory bandwidth, which measures the throughput of memory.
Memory refreshMemory refresh is the process of periodically reading information from an area of computer memory and immediately rewriting the read information to the same area without modification, for the purpose of preserving the information. Memory refresh is a background maintenance process required during the operation of semiconductor dynamic random-access memory (DRAM), the most widely used type of computer memory, and in fact is the defining characteristic of this class of memory.
POWER8POWER8 is a family of superscalar multi-core microprocessors based on the Power ISA, announced in August 2013 at the Hot Chips conference. The designs are available for licensing under the OpenPOWER Foundation, which is the first time for such availability of IBM's highest-end processors. Systems based on POWER8 became available from IBM in June 2014. Systems and POWER8 processor designs made by other OpenPOWER members were available in early 2015.
Massively parallel processor arrayA massively parallel processor array, also known as a multi purpose processor array (MPPA) is a type of integrated circuit which has a massively parallel array of hundreds or thousands of CPUs and RAM memories. These processors pass work to one another through a reconfigurable interconnect of channels. By harnessing a large number of processors working in parallel, an MPPA chip can accomplish more demanding tasks than conventional chips. MPPAs are based on a software parallel programming model for developing high-performance embedded system applications.
