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Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

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Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

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Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Microfluidic Scintillation Detectors for High Energy Physics

Methods and systems for power-efficient inductive chip-to-chip communications

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Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Microfluidic Scintillation Detectors for High Energy Physics

Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Methods and systems for power-efficient inductive chip-to-chip communications

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Parallel vs. Serial Inter-plane communication using TSVs

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Low temperature integration methods using conductive adhesives and dry film photoresist for flexible electronics

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration