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The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

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The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

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ELSEVIER SCIENCE SA2021

System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers

Edoardo Charbon, Sandro Carrara, Simone Frasca

A method for manufacturing vias in a silicon wafer, the silicon wafer having a crystal orientation, and having a plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having ...

2021

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Microstereolithography is a 3D microfabrication technology that is fundamentally different from the techniques commonly used in cleanroom environment for the manufacturing of MEMS components. Most microfabrication techniques evolved from the microelectroni ...

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Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Mikhail Asiatici, Göran Stemme

Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...

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Femtosecond laser assisted 3-dimensional freeform fabrication of metal microstructures in fused silica

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Ieee2016

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