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Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

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An ultra-low power energy-efficient microsystem for hydrogen gas sensing applications

Maher Kayal, François Krummenacher, Naser Khosro Pour

This paper presents a fully integrated power management and sensing microsystem that harvests solar energy from a micro-power photovoltaic module for autonomous operation of a miniaturized hydrogen sensor. In order to measure H-2 concentration, conductance ...

Springer US2013

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

An Analog Front-End and ADC Integrated Circuit for Implantable Force and Orientation Measurements in Joint Prosthesis

Kamiar Aminian, Philippe Renaud, Pierre-André Farine, Arnaud Bertsch, Arash Arami, Steve Tanner, Mirjana Banjevic, Willyan Hasenkamp Carreira, Shafqat Ali

The paper presents an analogue front-end and ADC integrated circuit for processing signals of sensors implanted into joint prosthesis. The circuit is designed to be operated with Wheatstone bridge sensors, such as strain gauges, pressure, Hall Effect, magn ...

Springer Berlin2013

Towards Multi-Fabric 3D Integration Architectures

Panagiotis Athanasopoulos

The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...

EPFL2012

Minimally invasive monitoring of the electrical activity of specific cortical areas using implantable microsystems offers the promise of diagnosing neurological diseases, as well as detecting and identifying neural activity patterns which are specific to a ...

EPFL2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

The advent of single-photon detectors known as Single-Photon Avalanche Diodes in standard CMOS technology opened the way to new perspectives in integrating these ultra sensitive light sensors with digital logic. Light has some interesting properties that a ...

EPFL2011

Ultra Compact and Low-power TDC and TAC Architectures for Highly-Parallel Implementation in Time-Resolved Image Sensors

Edoardo Charbon, Marek Gersbach

We report on the design and characterization of three different architectures, namely two Time-to- Digital Converters (TDCs) and a Time-to-Amplitude Converter (TAC) with embedded analog-to-digital conversion, implemented in a 130-nm CMOS imaging technology ...

2011

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Imaging techniques based on time-correlated single photon counting (TCSPC), such as fluorescence lifetime imaging microscopy (FLIM), rely on fast single-photon detectors as well as timing electronics in the form of time-to-digital or time-to-analog convert ...

Spie-Int Soc Optical Engineering, Po Box 10, Bellingham, Wa 98227-0010 Usa2010

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We have designed and fabricated a low-range (ca. 100 mN) thick-film piezoresistive force sensor with a cantilever beam fabricated in LTCC (Low Temperature Co-fired Ceramic). The beam was soldered onto a standard thick-film 25.4 x 12.7 mm signal conditionin ...

Elsevier2009