Mechanical characterization of a new high-aspect-ratio near UV-photoresist
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Incorporation of nanoparticles into photostructurable polymer materials enables the engineering of novel, highly integrated micro/nanosystems (MEMS/NEMS) with enhanced intrinsic functional properties. For instance, nanoparticles with (semi)conducting, opti ...
UV-imprint lithography has attracted attentions since its invention in 1996 together with thermal imprint lithography, which are so-called nanoimprint lithography (NIL). One of the characteristics of UV-imprint lithography is that a polymer layer to be str ...
The present thesis deals with new composite photoresists for the UV-LIGA and microstereolithography microfabrication processes. The aim is to build functional 3D objects, with high aspect ratio. Two projects have been investigated in parallel for each micr ...
The organic polymers incorporating inorganic nanoparticles can result in material possessing with unique size-dependent properties, such as mechanical, optical, electrical, thermal and magnetic, that can be istinctively conveyed into the composite by the s ...
The continuous downscaling of microelectronic circuits combined with increasing interest in ferroelectric thin films for non-volatile random access memories (FeRAM) is drawing great attention to small ferroelectric thin film structures. There are various c ...
Detailed investigations of the limits of a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We have demonstrated that with single- ...
We present results of the optical characterization of silicon photonic crystal waveguides and microcavities that are completely buried in a silicon dioxide cladding and are fabricated by deep ultraviolet (UV) lithography. The advantages of buried waveguide ...
A simplified process to fabricate high aspect ratio nanostructures in silicon combining electron beam lithography and deep reactive ion etching (DRIE) is presented. A stable process (HARSiN) has been developed without the need for complicated resist/hard m ...
We present results of the optical characterization of silicon photonic crystal waveguides and microcavities that are completely buried in a silicon dioxide cladding and are fabricated by deep ultraviolet (UV) lithography. The advantages of buried waveguide ...
IB-LIGA (Ion Beam Lithographie, Galvanoformung and Abformung) is a new technique for the 3D structuring of photoresist materials. It is a direct-write (maskless) technique that uses high energy (0.5-3.5 McV) light ions (protons or helium ions) for the irra ...