A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. SiPs are like systems on a chip (SoCs) but less tightly integrated and not on a single semiconductor die. SiP dies can be stacked vertically or tiled horizontally, with techniques like chiplets or quilt packaging, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiPs connect the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die. Many different 3D packaging techniques have been developed for stacking many fairly standard chip dies into a compact area. SiPs can contain several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like MP3 players and mobile phones as it reduces the complexity of the printed circuit board and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional.

À propos de ce résultat
Cette page est générée automatiquement et peut contenir des informations qui ne sont pas correctes, complètes, à jour ou pertinentes par rapport à votre recherche. Il en va de même pour toutes les autres pages de ce site. Veillez à vérifier les informations auprès des sources officielles de l'EPFL.
Cours associés (6)
MICRO-534: Advanced MEMS & microsystems
In depth analysis of the operation principles and technology of advanced micro- and nanosystems. Familiarisation to their implementation into products and their applications.
MICRO-333: Wireless sensor practicals
In this course, students will design, fabricate, and characterize a wireless sensor wearable. Students will design a custom-chosen wearable around a standardized wireless microcotroller platform, in
EE-594: Smart sensors for IoT
This lecture provides insights in the design and technologies of Internet-of-Things sensor nodes, with focus on low power technologies. The lectures alternate every two weeks between sensing technolog
Afficher plus
Séances de cours associées (32)
Emballage des systèmes intelligents
Couvre l'emballage des systèmes intelligents, des systèmes de soudure, des principaux types d'interconnexion de puces et des tendances d'emballage.
Détails d'emballage: Intégration 3D et technologies avancées
Explore les technologies d'emballage MEMS avancées, y compris l'intégration 3D, l'emballage hermétique et les processus d'emballage au niveau des plaquettes.
Conception de systèmes d'information : leçons tirées de CompuSys
Explore les défis dans la conception de systèmes d'information efficaces à l'aide de l'étude de cas de CompuSys.
Afficher plus
Publications associées (110)

Eco-Conscious Approach to Wireless Gas Monitoring With a Hybrid Printed Passive Sensor Tag

Johanna Zikulnig, Jürgen Kosel

Addressing the environmental impact of electronic waste in biomedical sensing, an eco-conscious approach to the realization of a Chitosan-based Acetone sensor tag for wireless gas monitoring is presented. The fabrication involves inkjet printing of silver ...
Ieee-Inst Electrical Electronics Engineers Inc2024

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...
2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...
2023
Afficher plus
Concepts associés (9)
Three-dimensional integrated circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Ordinateur
Un ordinateur est un système de traitement de l'information programmable tel que défini par Alan Turing et qui fonctionne par la lecture séquentielle d'un ensemble d'instructions, organisées en programmes, qui lui font exécuter des opérations logiques et arithmétiques. Sa structure physique actuelle fait que toutes les opérations reposent sur la logique binaire et sur des nombres formés à partir de chiffres binaires.
Encapsulation (électronique)
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Afficher plus

Graph Chatbot

Chattez avec Graph Search

Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.

AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.