Droplet-based microfluidicsDroplet-based microfluidics manipulate discrete volumes of fluids in immiscible phases with low Reynolds number and laminar flow regimes. Interest in droplet-based microfluidics systems has been growing substantially in past decades. Microdroplets offer the feasibility of handling miniature volumes (μl to fl) of fluids conveniently, provide better mixing, encapsulation, sorting, sensing and are suitable for high throughput experiments.
Manycore processorManycore processors are special kinds of multi-core processors designed for a high degree of parallel processing, containing numerous simpler, independent processor cores (from a few tens of cores to thousands or more). Manycore processors are used extensively in embedded computers and high-performance computing. Manycore processors are distinct from multi-core processors in being optimized from the outset for a higher degree of explicit parallelism, and for higher throughput (or lower power consumption) at the expense of latency and lower single-thread performance.
Hybrid integrated circuitA hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Embarrassingly parallelIn parallel computing, an embarrassingly parallel workload or problem (also called embarrassingly parallelizable, perfectly parallel, delightfully parallel or pleasingly parallel) is one where little or no effort is needed to separate the problem into a number of parallel tasks. This is often the case where there is little or no dependency or need for communication between those parallel tasks, or for results between them. Thus, these are different from distributed computing problems that need communication between tasks, especially communication of intermediate results.
Encapsulation (électronique)In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Application-specific integrated circuitvignette|Un ASIC. Un ASIC (acronyme de l'anglais application-specific integrated circuit, littéralement « circuit intégré propre à une application ») est un circuit intégré spécialisé. En général, il regroupe sur la même puce un ou sur mesure. thumb|Autre exemple de puce ASIC. L'intérêt de l'intégration est de réduire les coûts de production et d'augmenter la fiabilité. Avantage pour le maître d'œuvre : un contrôle total du produit et un coût de production réduit.
Co-fired ceramicCo-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
Silicon on sapphireSilicon on sapphire (SOS) is a hetero-epitaxial process for metal–oxide–semiconductor (MOS) integrated circuit (IC) manufacturing that consists of a thin layer (typically thinner than 0.6 μm) of silicon grown on a sapphire (Al2O3) wafer. SOS is part of the silicon-on-insulator (SOI) family of CMOS (complementary MOS) technologies. Typically, high-purity artificially grown sapphire crystals are used. The silicon is usually deposited by the decomposition of silane gas (SiH4) on heated sapphire substrates.
Circuit logique programmableUn circuit logique programmable ou PLD (Programmable Logical Device), est un circuit intégré logique qui peut être programmé après sa fabrication. Il se compose de nombreuses cellules logiques élémentaires contenant des bascules logiques librement connectables. L'utilisateur doit donc programmer le circuit avant de l'utiliser. Les différentes logiques de programmation (unique, reprogrammable) et d'architecture ont conduit à la création de sous-familles dont les plus connues sont les FPGA et les CPLD.
Processeur graphiqueUn processeur graphique, ou GPU (de l'anglais Graphics Processing Unit), également appelé coprocesseur graphique sur certains systèmes, est une unité de calcul assurant les fonctions de calcul d'image. Il peut être présent sous forme de circuit intégré (ou puce) indépendant, soit sur une carte graphique ou sur la carte mère, ou encore intégré au même circuit intégré que le microprocesseur général (on parle d'un SoC lorsqu'il comporte toutes les puces spécialisées).
