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We have developed a novel batch-type technology for making three-dimensional (3-D) millimeter-sized transformers for ultrasmall low-power (0.1 to 1 Watt) applications. The technology uses the 3-D micropatterning of ferrite wafers by powder blasting to form the magnetic cores of the inductive devices, and combines these cores with electrical windings made by flex-foil printed circuit board technology. Microfabrication and assembly of the parts can be done in a batch process on a wafer/foil level, opening the way to further size reduction of the components. We have measured the inductive and resistive properties of our devices as a function of frequency and device geometry. The results clearly show the high potential of our technology for power applications in which small-size is important.
Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Hongkeng Zhu, Armin Jafari, Palliyage Srilak Nirmana Perera
Drazen Dujic, Andrea Cervone, Jules Christian Georges Macé, Max Dupont, Renan Pillon Barcelos