Explores silicon wafer preparation for photovoltaic devices, covering quality, costs, wafering techniques, mechanical properties, and industry trends.
Covers distributed memory systems, cache organization, multi-socket architectures, memory coherence, and on-chip interconnect design.
Explores the implementation of logic gates in semiconductor material, focusing on TTL and CMOS technologies, ICs, hazards, clocks, D flip-flops, and switch debouncing.
Explores the transistor figures of merit, covering MOSFET models, velocity saturation effects, and current efficiency.
Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.
Introduces the design of analog CMOS integrated circuits and emphasizes the importance of good analog design skills.
