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Lecture
MEMS: Advanced Introduction
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Related lectures (30)
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Sensors Technologies Comparison
Explores sensor technologies in MEMS, focusing on pressure sensors, accelerometers, and gyroscopes, and highlights the significance of sensor fusion.
Circular Materials Economy: Nanocellulose Applications
Delves into circular materials economy and nanocellulose applications in sustainability and various industries.
Chip Packaging Process Flow: Major Steps
Covers the major steps in chip packaging and the evolution of packaging technologies.
Capacitive MEMS Sensors: Working Principles
Explains the working principles of capacitive MEMS sensors, differential capacitors, MEMS microphones, and the impact of MEMS technology on consumer products.
Packaging of Intelligent Systems
Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.
Heat Exchanger Design
Covers the design of a heat exchanger using exhaust gas to generate steam.
Revision: Simple Differential Amplifier
Covers the revision of a simple differential amplifier, emphasizing the importance of staying in protected mode.
MEMS Packaging: Techniques and Considerations
Explores MEMS packaging techniques, including bonding methods and key considerations for ensuring reliability and functionality.
Accelerometer Unit Development
Explores the development of a real-time three-axis accelerometer and its diverse applications.
Low Power Sensor Technology for IoT and Wearables
Covers low power sensor technology for IoT and wearables, focusing on activity sensors based on MEMS and biosignals.
