Advanced MEMS Packaging

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Related lectures (15)

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Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

MEMS Packaging: 3D Integration & Advanced Technologies

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

Infrared Photodetectors: Mercury Cadmium Telluride Technology

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

Molecular Transistors: Design and Simulation

Explores molecular transistors for logic computation, design, simulation, and fabrication, emphasizing interconnect parasitics and device performance.

VLSI Testing: Techniques and Economics

Explores test techniques for digital VLSI systems, covering fault modeling, test-pattern generation, and design for testability.

MEMS Packaging: Techniques and Considerations

Explores MEMS packaging techniques, including bonding methods and key considerations for ensuring reliability and functionality.

MEMS Resonators and Oscillators

Explores MEMS resonators and oscillators, CMOS integration, frequency stability, temperature drift compensation, resonator packaging, and advanced resonator structures.

Test of VLSI Systems

Covers test techniques for digital VLSI systems, including fault modeling and design for testability.