MEMS Packaging: 3D Integration & Advanced Technologies

This lecture covers advanced MEMS packaging technologies, including 3D integration, wafer-level packaging, through silicon vias, and hermetic packaging. It discusses the benefits of 3D integration, the differences between 2.5D and 3D integration, and the fabrication processes of TSVs. The instructor explains the importance of hermetic packaging, materials used, bonding techniques, and the role of getters. Various packaging techniques such as surface bonding, anodic bonding, and eutectic bonding are explored, highlighting their advantages and drawbacks. The lecture also delves into the challenges of gas leakage characterization in hermetic packaging and the need for compact systems through chip-level 3D solutions.