Lecture
This lecture explores the interactions between ions and target material in physical vapor deposition (PVD) processes, detailing how ions remove material from the target and sputter it onto a substrate. It covers the effects of ion kinetic energy, type of ion, and target material, as well as the formation of compounds, surface damage, and chemical reactions. The lecture also delves into the mechanisms of sputtering, the creation of secondary electrons and ions, and the emission of photons and x-rays. It emphasizes the importance of cooling in sputtering processes and contrasts the deposition of compounds in sputtering with thermal or electron beam evaporation methods. The factors influencing the target ejection rate, such as sputtering yield, voltage, pressure, and inter-electrode distance, are also discussed.