Publication
Low temperature co-fired ceramic (LTCC) technology: general processing aspects and fabrication of 3-D structures for micro-fluidic devices
Related publications (33)
Integrated LTCC pressure / flow / temperature multisensor for compressed air diagnostics
Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Nicolas Craquelin, Grégoire Boutinard Rouelle
We present a multisensor designed for industrial compressed air diagnostics and combining the measurement of pressure, flow, and temperature, integrated with the corresponding signal conditioning electronics in a single low-temperature co-fired ceramic (LT ...
2010Formulation of composite resistive pastes for fabrication of micro-heaters
Peter Ryser, Thomas Maeder, Nathalie Sophie Adeline Serra, Pierre Lemaire
We investigate in this work the formulation of composite resistive pastes based on epoxy resins and graphite for micro-heater manufacturing via thick-film technology. These resistive pastes are designed for screen-printing onto a printed circuit board (PCB ...
Elsevier2010Fast and robust hydrogen sensors based on discontinuous palladium films on polyimide, fabricated on a wafer scale
Jürgen Brugger, Luis Guillermo Villanueva Torrijo, Thomas Kiefer
Fast hydrogen sensors based on discontinuous palladium (Pd) films on supporting polyimide layers, fabricated by a cost-efficient and full-wafer compatible process, are presented. The films, deposited by electron-beam evaporation with a nominal thickness of 1. ...
Institute of Physics2010Formulation of composite resistive pastes for micro-heater manufacturing
Peter Ryser, Thomas Maeder, Nathalie Sophie Adeline Serra, Pierre Lemaire
We investigate in this work the formulation of composite resistive pastes based on epoxy resins and graphite for micro-heater manufacturing via thick-film technology. The resistive paste is first screen-printed onto a printed circuit board (PCB) substrate, ...
Elsevier2009Temperature dependence of the conductivity in large-grained boron-doped ZnO films
Christophe Ballif, Arvind Shah, Sylvie Faÿ
The temperature dependence of the conductivity is investigated as a function of boron doping in large-grained, degenerate polycrystalline ZnO films prepared by low-pressure chemical vapor deposition. Carrier transport in undoped and lightly doped films is ...
2007Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules
Peter Ryser, Thomas Maeder, Hansu Birol
LTCC technology offers low temperature firing (
Trans Tech Publications2006Temperature measurements in microfluidic systems: Heat dissipation of negative dielectrophoresis barriers
Philippe Renaud, Martin Jordan, Urban Seger, Silvan Schnydrig
The manipulation of living biological cells in microfluidic channels by a combination of negative dielectrophoretic barriers and pressure-driven flows is widely employed in lab-on-a-chip systems. However, electric fields in conducting media induce Joule he ...
2005Pulsed laser deposition of (SrBa)Nb2O6 thin films and their properties
Strontium barium niobate (SrxBa1-xNb2O6, shortly SBN) is a solid solution system with tetragonal tungsten bronze crystal structure. It exhibits a ferroelectric phase with only one polar axis and a transition temperature depending on the Sr/Ba ratio. This t ...
EPFL2005Advancing towards well-controlled full-wafer nanostencil lithography
Jürgen Brugger, Marc Antonius Friedrich van den Boogaart, Nao Takano
The endeavour to develop nanodevices demands for patterning methods in the nanoscale. To bring nanodevices to the market, there is a need for fast, low-cost replication nanopatterning methods. In addition, an increased flexibility of the nanopatterning met ...
2005Integration of robust fluidic interconnects using metal to glass anodic bonding
This paper reports on the encapsulation of a piezoresistive silicon/Pyrex liquid flow sensor using metal to glass anodic bonding. The bonding technique allowed integrating robust metallic microfluidic interconnects and eliminating the use of glue and O-rin ...
2005