Plasma etching

Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma. Eventually the atoms of the shot element embed themselves at or just below the surface of the target, thus modifying the physical properties of the target. A plasma is a high energetic condition in which a lot of processes can occur. These processes happen because of electrons and atoms. To form the plasma electrons have to be accelerated to gain energy. Highly energetic electrons transfer the energy to atoms by collisions. Three different processes can occur because of this collisions: Excitation Dissociation Ionization Different species are present in the plasma such as electrons, ions, radicals, and neutral particles. Those species are interacting with each other constantly. Plasma etching can be divided into two main types of interaction: generation of chemical species interaction with the surrounding surfaces Without a plasma, all those processes would occur at a higher temperature. There are different ways to change the plasma chemistry and get different kinds of plasma etching or plasma depositions. One of the excitation techniques to form a plasma is by using RF excitation of a power source of 13.56 MHz. The mode of operation of the plasma system will change if the operating pressure changes. Also, it is different for different structures of the reaction chamber. In the simple case, the electrode structure is symmetrical, and the sample is placed upon the grounded electrode. The key to develop successful complex etching processes is to find the appropriate gas etch chemistry that will form volatile products with the material to be etched as shown in Table 1.