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Concept
Wire bonding
Summary
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Bondwires usually consist of one of the following materials:
Aluminium
Copper
Silver
Gold
Wire diameters start from under 10 μm and can be up to several hundred micrometres for high-powered applications.
The wire bonding industry is transitioning from gold to copper. This change has been instigated by the rising cost of gold and the comparatively stable, and much lower, cost of copper. While possessing higher thermal and electrical conductivity than gold, copper had previously been seen as less reliable due to its hardness and susceptibility to corrosion. By 2015, it is expected that more than a third of all wire bonding machines in use will be set up for copper.
Copper wire has become one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications. Copper is used for fine wire ball bonding in sizes from up to . Copper wire has the ability of being used at smaller diameters providing the same performance as gold without the high material cost.
Copper wire up to can be successfully wedge bonded. Large diameter copper wire can and does replace aluminium wire where high current carrying capacity is needed or where there are problems with complex geometry. Annealing and process steps used by manufacturers enhance the ability to use large diameter copper wire to wedge bond to silicon without damage occurring to the die.
Copper wire does pose some challenges in that it is harder than both gold and aluminium, so bonding parameters must be kept under tight control.
Official source
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