Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.
Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.
Covers advanced topics in MEMS technology, including design, packaging, device categories, historical perspective, market trends, and the role of startups.
Covers test techniques for digital VLSI systems, including fault modeling and design for testability.
