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Lecture
Packaging of Intelligent Systems
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Related lectures (31)
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Chip Packaging Process Flow: Major Steps
Covers the major steps in chip packaging and the evolution of packaging technologies.
Packaging of Intelligent Systems
Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.
Advanced MEMS Packaging
Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.
MEMS Packaging: 3D Integration & Advanced Technologies
Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.
MEMS Packaging: Techniques and Considerations
Explores MEMS packaging techniques, including bonding methods and key considerations for ensuring reliability and functionality.
Infrared Photodetectors: Mercury Cadmium Telluride Technology
Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.
Soldering and Brazing: Fundamentals and Techniques
Covers soldering and brazing fundamentals, eutectic alloys, joint interfaces, fluxes, aluminum brazing challenges, and hybrid metal-ceramic parts.
Microcontrollers: Basics and Applications
Covers the basics of microcontrollers, different packaging types, circuit implementation methods, and software tools for circuit design.
MEMS: Advanced Introduction
Covers advanced topics in MEMS technology, including design, packaging, device categories, historical perspective, market trends, and the role of startups.
Silicon Chip Design
Discusses silicon chip design, metal layer layout, shielding layers, and design challenges.
